| 8183133 |
Method for producing semiconductor substrate |
Satoshi Murakami, Nobuyuki Morimoto, Akihiko Endo |
2012-05-22 |
| 8003494 |
Method for producing a bonded wafer |
Nobuyuki Morimoto, Tatsumi Kusaba, Akihiko Endo |
2011-08-23 |
| 7960225 |
Method of controlling film thinning of semiconductor wafer for solid-state image sensing device |
Etsurou Morita, Akihiko Endo, Yoshihisa Nonogaki |
2011-06-14 |
| 7951692 |
Method of producing semiconductor substrate having an SOI structure |
Satoshi Murakami, Nobuyuki Morimoto, Akihiko Endo |
2011-05-31 |
| 7927957 |
Method for producing bonded silicon wafer |
Tatsumi Kusaba, Akihiko Endo, Nobuyuki Morimoto |
2011-04-19 |
| 7858494 |
Laminated substrate manufacturing method and laminated substrate manufactured by the method |
Akihiko Endo, Nobuyuki Morimoto |
2010-12-28 |
| 7851337 |
Method for producing semiconductor substrate |
Satoshi Murakami, Nobuyuki Morimoto, Akihiko Endo |
2010-12-14 |
| 7795117 |
Method of producing semiconductor substrate having an SOI structure |
Satoshi Murakami, Nobuyuki Morimoto, Akihiko Endo |
2010-09-14 |
| 7713842 |
Method for producing bonded wafer |
Isoroku Ono, Akihiko Endo |
2010-05-11 |
| 7625808 |
Method for manufacturing bonded wafer |
Akihiko Endo |
2009-12-01 |
| 7563697 |
Method for producing SOI wafer |
Nobuyuki Morimoto |
2009-07-21 |
| 7534728 |
Process for cleaning silicon substrate |
Tatsumi Kusaba, Nobuyuki Morimoto |
2009-05-19 |
| 7510948 |
Method for producing SOI wafer |
Nobuyuki Morimoto |
2009-03-31 |
| 7507641 |
Method of producing bonded wafer |
Nobuyuki Morimoto |
2009-03-24 |
| 7485874 |
Apparatus for manufacturing semiconductor substrates |
Seiichi Nakamura, Riyuusuke Kasamatsu, Kazunori Tsubuku, Akira Bando, Nobuo Tsumaki +4 more |
2009-02-03 |
| 7410877 |
Method for manufacturing SIMOX wafer and SIMOX wafer |
Yoshiro Aoki, Riyuusuke Kasamatsu, Seiichi Nakamura |
2008-08-12 |
| 7358147 |
Process for producing SOI wafer |
Nobuyuki Morimoto |
2008-04-15 |