Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11506990 | Light emitting device, exposure device, and image forming apparatus | Yosuke Kasuya | 2022-11-22 |
| 11347160 | Light emitting device, exposure device, and image forming apparatus | Yosuke Kasuya | 2022-05-31 |
| 8802540 | Method of manufacturing bonded wafer | Nobuyuki Morimoto | 2014-08-12 |
| 8330222 | Epitaxial wafer and production method thereof | Yoshiro Aoki, Noashi Adachi, Yoshihisa Nonogaki | 2012-12-11 |
| 8183133 | Method for producing semiconductor substrate | Satoshi Murakami, Nobuyuki Morimoto, Hideki Nishihata | 2012-05-22 |
| 8173553 | Epitaxial wafer and production method thereof | Yoshiro Aoki, Noashi Adachi, Yoshihisa Nonogaki | 2012-05-08 |
| 8110486 | Method of manufacturing semiconductor wafer by forming a strain relaxation SiGe layer on an insulating layer of SOI wafer | Koji Matsumoto, Tomoyuki Hora, Etsurou Morita, Masaharu Ninomiya | 2012-02-07 |
| 8048769 | Method for producing bonded wafer | Nobuyuki Morimoto, Etsurou Morita | 2011-11-01 |
| 8048767 | Bonded wafer and method for producing bonded wafer | Nobuyuki Morimoto | 2011-11-01 |
| 8003494 | Method for producing a bonded wafer | Hideki Nishihata, Nobuyuki Morimoto, Tatsumi Kusaba | 2011-08-23 |
| 7960225 | Method of controlling film thinning of semiconductor wafer for solid-state image sensing device | Etsurou Morita, Yoshihisa Nonogaki, Hideki Nishihata | 2011-06-14 |
| 7951692 | Method of producing semiconductor substrate having an SOI structure | Satoshi Murakami, Nobuyuki Morimoto, Hideki Nishihata | 2011-05-31 |
| 7927972 | Method for producing bonded wafer | Tatsumi Kusaba | 2011-04-19 |
| 7927957 | Method for producing bonded silicon wafer | Tatsumi Kusaba, Hideki Nishihata, Nobuyuki Morimoto | 2011-04-19 |
| 7902043 | Method of producing bonded wafer | Nobuyuki Morimoto | 2011-03-08 |
| 7867877 | Method for manufacturing SOI wafer | Etsuro Morita | 2011-01-11 |
| 7858494 | Laminated substrate manufacturing method and laminated substrate manufactured by the method | Hideki Nishihata, Nobuyuki Morimoto | 2010-12-28 |
| 7855132 | Method of manufacturing bonded wafer | Nobuyuki Morimoto | 2010-12-21 |
| 7851337 | Method for producing semiconductor substrate | Satoshi Murakami, Nobuyuki Morimoto, Hideki Nishihata | 2010-12-14 |
| 7795117 | Method of producing semiconductor substrate having an SOI structure | Satoshi Murakami, Nobuyuki Morimoto, Hideki Nishihata | 2010-09-14 |
| 7790573 | Process for producing SOI substrate and process for regeneration of layer transferred wafer in the production | Toshiaki Ono, Wataru Sugimura | 2010-09-07 |
| 7767549 | Method of manufacturing bonded wafer | Hidehiko Okuda, Tatsumi Kusaba | 2010-08-03 |
| 7763541 | Process for regenerating layer transferred wafer | Hidehiko Okuda, Tatsumi Kusaba | 2010-07-27 |
| 7736998 | Silicon-on insulator substrate and method for manufacturing the same | Etsurou Morita, Ritarou Sano | 2010-06-15 |
| 7718509 | Method for producing bonded wafer | Tatsumi Kusaba | 2010-05-18 |