HO

Hidehiko Okuda

SU Sumco: 9 patents #31 of 464Top 7%
Overall (All Time): #580,839 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7939441 P-type silicon wafer and method for heat-treating the same Tatsumi Kusaba 2011-05-10
7767549 Method of manufacturing bonded wafer Tatsumi Kusaba, Akihiko Endo 2010-08-03
7763541 Process for regenerating layer transferred wafer Akihiko Endo, Tatsumi Kusaba 2010-07-27
7745306 Method for producing bonded wafer Tatsumi Kusaba 2010-06-29
7541663 P-type silicon wafer and method for heat-treating the same Tatsumi Kusaba 2009-06-02
7416960 Method for manufacturing SOI substrate Akihiko Endo, Tatsumi Kusaba, Etsurou Morita 2008-08-26
7364984 Method for manufacturing SOI substrate Akihiko Endo, Tatsumi Kusaba, Etsurou Morita 2008-04-29
7354844 Method for manufacturing SOI substrate Akihiko Endo, Tatsumi Kusaba, Etsurou Morita 2008-04-08
7311775 Method for heat-treating silicon wafer and silicon wafer Tatsumi Kusaba, Yoshihisa Nonogaki 2007-12-25