Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9288891 | Conductive element and method of manufacturing the same, wiring element, and master copy | Kazuya Hayashibe, Shunichi Kajiya | 2016-03-15 |
| 9116289 | Transparent conductive element, information input apparatus, and display apparatus | Shunichi Kajiya, Kazuya Hayashibe, Sohmei Endoh | 2015-08-25 |
| 8467130 | Retardation film, method of producing the same and display device | Akito Kuriyama, Keitaro Kitada, Kei Obata, Junichi Inoue | 2013-06-18 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Naohiko Hirano, Eiichi Hosomi, Chiaki Takubo, Kazuhide Doi +2 more | 2000-08-29 |
| 6061466 | Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads | Chiaki Takubo, Eiichi Hosomi, Koji Shibasaki | 2000-05-09 |
| 6049130 | Semiconductor device using gold bumps and copper leads as bonding elements | Eiichi Hosomi, Chiaki Takubo, Koji Shibasaki | 2000-04-11 |
| 5825081 | Tape carrier and assembly structure thereof | Eiichi Hosomi, Chiaki Takubo, Koji Shibasaki | 1998-10-20 |
| 5801447 | Flip chip mounting type semiconductor device | Naohiko Hirano, Kazuhide Doi, Chiaki Takubo, Eiichi Hosomi, Yoichi Hiruta +2 more | 1998-09-01 |
| 5773888 | Semiconductor device having a bump electrode connected to an inner lead | Eiichi Hosomi, Chiaki Takubo, Koji Shibasaki | 1998-06-30 |
| 5747881 | Semiconductor device, method of fabricating the same and copper leads | Eiichi Hosomi, Chiaki Takubo, Koji Shibasaki | 1998-05-05 |
| 5631499 | Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics | Eiichi Hosomi, Chiaki Takubo, Ryouichi Miyamoto, Takashi Arai, Koji Shibasaki | 1997-05-20 |
| 5615822 | Method and apparatus for controlling bonding load of fine lead electrode | Chiaki Takubo, Eiichi Hosomi, Koji Shibasaki | 1997-04-01 |
| 5508563 | Semiconductor assembly having laminated semiconductor devices | Chiaki Takubo, Yoshiharu Tsuboi, Mamoru Sasaki | 1996-04-16 |
| 5394010 | Semiconductor assembly having laminated semiconductor devices | Chiaki Takubo, Yoshiharu Tsuboi, Mamoru Sasaki | 1995-02-28 |
| 5304843 | Semiconductor device using film carrier | Chiaki Takubo, Yoshiharu Tsuboi, Masao Mochizuki | 1994-04-19 |
| 5220486 | IC packing device | Chiaki Takubo, Yoshiharu Tsuboi | 1993-06-15 |