RS

Reinhard Stengl

SA Siemens Aktiengesellschaft: 45 patents #51 of 22,248Top 1%
Infineon Technologies Ag: 23 patents #305 of 7,486Top 5%
IBM: 10 patents #10,888 of 70,183Top 20%
KT Kabushiki Kaisha Toshiba: 2 patents #9,982 of 21,451Top 50%
DU Duke University: 1 patents #1,064 of 2,315Top 50%
📍 Munich, NC: #1 of 6 inventorsTop 20%
Overall (All Time): #30,374 of 4,157,543Top 1%
69
Patents All Time

Issued Patents All Time

Showing 51–69 of 69 patents

Patent #TitleCo-InventorsDate
5674769 Process for forming deep trench DRAMs with sub-groundrule gates Johann Alsmeier, Christine Dehm, Erwin Hammerl 1997-10-07
5670805 Controlled recrystallization of buried strap in a semiconductor memory device Erwin Hammerl, Jack A. Mandelman, Herbert L. Ho, Junichi Shiozawa 1997-09-23
5663107 Global planarization using self aligned polishing or spacer technique and isotropic etch process Matthias Peschke 1997-09-02
5643836 Method for producing a semiconductor layer structure having a planarized surface and the use thereof in the manufacture of bipolar transistors and DRAMS Thomas Meister 1997-07-01
5627092 Deep trench dram process on SOI for low leakage DRAM cell Johann Alsmeier 1997-05-06
5543348 Controlled recrystallization of buried strap in a semiconductor memory device Erwin Hammerl, Jack A. Mandelman, Herbert L. Ho, Junichi Shiozawa 1996-08-06
5498567 Method for manufacturing a laterally limited, single-crystal region on a substrate and the employment thereof for the manufacture of an MOS transistor and a bipolar transistor Helmut Klose, Thomas Meister, Hans-Willi Meul 1996-03-12
5449310 Method for manufacturing rod-shaped silicon structures Wolfgang Hoenlein 1995-09-12
5432120 Method for producing a laterally limited single-crystal region with selective epitaxy and the employment thereof for manufacturing a bipolar transistor as well as a MOS transistor Thomas Meister 1995-07-11
5422303 Method for manufacturing a laterally limited, single-crystal region on a substrate and the employment thereof for the manufacture of an MOS transistor and a bipolar transistor Helmut Klose, Thomas Meister, Hans-Willi Meul 1995-06-06
5360759 Method for manufacturing a component with porous silicon Wolfgang Hoenlein, Volker Lehmann, Andreas Spitzer 1994-11-01
5326718 Method for manufacturing a laterally limited, single-crystal region on a substrate and the employment thereof for the manufacture of an MOS transistor and a bipolar transistor Helmut Klose, Thomas Meister, Hans-Willi Meul 1994-07-05
5306647 Method for manufacturing a solar cell from a substrate wafer Volker Lehmann, Hermann Wendt, Wolfgang Hoenlein, Josef Willer 1994-04-26
5188977 Method for manufacturing an electrically conductive tip composed of a doped semiconductor material Hans-Willi Meul, Wolfgang Hoenlein 1993-02-23
5113237 Planar pn-junction of high electric strength 1992-05-12
4980742 Turn-off thyristor Klaus-Guenter Oppermann 1990-12-25
4907056 Semiconductor component comprising a planar pn-junction Ulrich M. Goesele 1990-03-06
4883215 Method for bubble-free bonding of silicon wafers Ulrich M. Goesele 1989-11-28
4672738 Method for the manufacture of a pn junction with high breakdown voltage Ulrich M. Goesele, Christine Fellinger 1987-06-16