Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905726 | Component having at least two mutually adjacent insulating layers and corresponding production method | Klaus Lowack, Günter Schmid | 2005-06-14 |
| 6900284 | POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, PROCESSES FOR PRODUCING POLY-O-HYDROXYAMIDES, PROCESSES FOR PRODUCING POLYBENZOXAZOLES, DIELECTRICS INCLUDING A POLYBENZOXAZOLE, ELECTRONIC COMPONENTS INCLUDING THE DIELECTRICS, AND PROCESSES FOR MANUFACTURING THE ELECTRONIC COMPONENTS | Klaus Lowack, Anna Maltenberger, Andreas Walter | 2005-05-31 |
| 6884567 | Photosensitive formulation for buffer coatings, film containing the photosensitive formulation, and method for fabricating electronics with the photosensitive formulation | — | 2005-04-26 |
| 6866980 | Bis-o-aminophenol derivatives, poly-o-hydroxyamides, and polybenzoxazoles, usable in photosensitive compositions, dielectrics, buffer coatings, and microelectronics | — | 2005-03-15 |
| 6861560 | Bis-o-aminophenols and processes for producing bis-o-aminophenols | Andreas Walter, Ingo Gnüchtel, Anna Maltenberger, Horst Hartmann | 2005-03-01 |
| 6861479 | Composition and process for the production of a porous layer using the composition | — | 2005-03-01 |
| 6835456 | Antireflective, layer-forming composition, layer configuration containing the antireflective layer, and process for producing the antireflective layer | Andreas Walter | 2004-12-28 |
| 6824642 | Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties | Andreas Walter | 2004-11-30 |
| 6824949 | Polybenzoxazole precursors, photoresist solution, polybenzoxazole, and process for preparing a polybenzoxazole precursor | Jörg Haussmann, Gerhard Maier, Günter Schmid | 2004-11-30 |
| 6806344 | POLY-O-HYDROXAMIDE, POLYBENZOXAZOLE, AND ELECTRONIC COMPONENT INCLUDING A DIELECTRIC HAVING A BARRIER EFFECT AGAINST COPPER DIFFUSION, AND PROCESSES FOR PREPARING POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, AND ELECTRONIC COMPONENTS | Andreas Walter, Anna Maltenberger, Klaus Lowack | 2004-10-19 |
| 6787244 | Adhesively bonded chip-and wafer stacks | Andreas Walter | 2004-09-07 |
| 6635410 | Metallizing method for dielectrics | Joerg Haussmann, Klaus Lowack, Wolfgang Radlik, Guenter Schmid | 2003-10-21 |
| 6599687 | Process for producing structured protective and insulating layers | Ewald Karl Michael Günther, Michael Keitmann | 2003-07-29 |
| 6531632 | Bis-o-aminophenols and o-aminophenolcarboxylic acids and process for preparing the same | Jörg Haussmann, Gerhard Maier | 2003-03-11 |
| 6437178 | O-aminophenolcarboxylic acid and o-aminothiophenolcarboxylic acid | Michael Keitmann | 2002-08-20 |
| 6320081 | O-Nitro(thio)phenol derivatives, and their preparation | Michael Keitmann, Andreas Weber | 2001-11-20 |
| 6310238 | O-amino(thio)phenolcarboxylic acids, and their preparation | Michael Keitmann | 2001-10-30 |
| 6194482 | UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components | Barbara Lehner | 2001-02-27 |
| 6156902 | Bis-o-amino (thio) phenols, and their preparation | Michael Keitmann, Andreas Weber | 2000-12-05 |
| 6153350 | Polybenzoxazole and polybenzothiazole precursors | Michael Keitmann, Gunther Schmid | 2000-11-28 |
| 6150558 | Bis-o-amino(thio)phenols, and their preparation | Michael Keitmann | 2000-11-21 |
| 6120970 | Polybenzoxazole and polybenzothiazole precursors | Michael Keitmann | 2000-09-19 |
| 6110637 | Photoresists which are suitable for producing sub-micron size structures | Rainer Leuschner, Horst Borndoerfer, Michael Sebald, Siegfried Birkle, Hellmut Ahne | 2000-08-29 |
| 6096921 | O-amino(thio)phenolcarboxylic acids, and their preparation | Michael Keitmann | 2000-08-01 |
| 6037043 | UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components | Barbara Lehner | 2000-03-14 |