HA

Hellmut Ahne

SA Siemens Aktiengesellschaft: 61 patents #29 of 22,248Top 1%
Overall (All Time): #38,300 of 4,157,543Top 1%
61
Patents All Time

Issued Patents All Time

Showing 25 most recent of 61 patents

Patent #TitleCo-InventorsDate
6110637 Photoresists which are suitable for producing sub-micron size structures Recai Sezi, Rainer Leuschner, Horst Borndoerfer, Michael Sebald, Siegfried Birkle 2000-08-29
5973202 Preparation of poly-o-hydroxyamides and poly o-mercaptoamides Recai Sezi, Eva Rissel, Kurt Geibel 1999-10-26
5922825 Preparation of poly-o-hydroxyamides and poly o-mercaptoamides Recai Sezi, Eberhard Kuehn 1999-07-13
5883221 Synthesis of polybenzoxasole and polybenzothiazole precursors Recai Sezi, Eberhard Kuehn, Sueleyman Kocman 1999-03-16
5807969 Preparation of poly-O-hydroxyamides and poly O-mercaptoamides Recai Sezi, Eberhard Kuehn, Roland Gestigkeit 1998-09-15
5783654 Preparation of poly-O-hydroxyamides and poly O-mercaptoamides Recai Sezi 1998-07-21
5777066 Method for the production of poly-o-hydroxyamides Recai Sezi, Eva Rissel 1998-07-07
5760162 Preparation of poly-o-hydroxyamides and poly-o-mercaptoamides Recai Sezi, Roland Gestigkeit, Kurt Geibel 1998-06-02
5750638 Method for the production of poly-o-hydroxyamides Recai Sezi, Roland Gestigkeit 1998-05-12
5750711 Dicarboxylic acid derivatives Racai Sezi, Eberhard Kuehn 1998-05-12
5733706 Dry-developable positive resist Recai Sezi, Rainer Leuschner, Horst Borndorfer, Eva Rissel, Michael Sebald +2 more 1998-03-31
5726279 Preparation of poly-o-hydroxyamides and poly o-mercaptoamides Recai Sezi 1998-03-10
5703186 Mixed polymers Recai Sezi, Horst Borndoerfer, Siegfried Birkle, Eberhard Kuehn, Rainer Leuschner +2 more 1997-12-30
5696218 Preparation of poly-o-hydroxyamides and poly-o-mercaptoamides Recai Sezi, Roland Gestigkeit 1997-12-09
5688631 Methods for producing polybenzoxazol precursors and corresponding resist solutions Recai Sezi, Eva Rissel 1997-11-18
5616667 Copolymers Recai Sezi, Horst Borndoerfer, Siegfried Birkle, Eberhard Kuehn, Rainer Leuschner +2 more 1997-04-01
5556812 Connection and build-up technique for multichip modules Rainer Leuschner, Siegfried Birkle, Albert Hammerschmidt, Recai Sezi, Tobias Noll +1 more 1996-09-17
5384220 Production of photolithographic structures Recai Sezi, Horst Borndoerfer, Rainer Leuschner, Michael Sebald, Siegfried Birkle 1995-01-24
5376499 Highly heat-resistant positive resists comprising end-capped hydroxypolyamides Albert Hammerschmidt, Siegfried Birkle 1994-12-27
5278277 Phenylquinoxaline copolymers Lothar Zapf 1994-01-11
5275920 Method of dry development utilizing quinone diazide and basic polymer resist with latent image intensification through treatment with silicon-organic compound in water Recai Sezi, Rainer Leuschner, Michael Sebald, Siegfried Birkle 1994-01-04
5262283 Method for producing a resist structure Recai Sezi, Horst Borndorfer, Eva Rissel, Rainer Leuschner, Michael Sebald +1 more 1993-11-16
5250375 Photostructuring process Michael Sebald, Juergen Beck, Rainer Leuschner, Recai Sezi, Siegfried Birkle +1 more 1993-10-05
5234794 Photostructuring method Michael Sebald, Rainer Leuschner, Recai Sezi, Siegfried Birkle 1993-08-10
5234793 Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development Michael Sebald, Recai Sezi, Rainer Leuschner, Siegfried Birkle 1993-08-10