Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5827779 | Method of manufacturing semiconductor mirror wafers | Kiyoshi Suzuki, Hideo Kudo | 1998-10-27 |
| 5827395 | Polishing pad used for polishing silicon wafers and polishing method using the same | Kiyoshi Suzuki, Hideo Kudo | 1998-10-27 |
| 5821167 | Method of manufacturing semiconductor mirror wafers | Teruaki Fukami, Kiyoshi Suzuki, Hideo Kudo | 1998-10-13 |
| 5800725 | Method of manufacturing semiconductor wafers | Tadahiro Kato, Hideo Kudo | 1998-09-01 |
| 5790252 | Method of and apparatus for determining residual damage to wafer edges | Hideo Kudo, Shingo Sumie, Hidetoshi Tsunaki, Yuji Hirao, Noritaka Morioka | 1998-08-04 |
| 5759087 | Method for inducing damage for gettering to single crystal silicon wafer | Masami Nakano, Hideo Kudo | 1998-06-02 |
| 5705423 | Epitaxial wafer | Atsuto Sakata, Hideo Kudo | 1998-01-06 |
| 5667567 | Polishing agent used for polishing silicon wafers and polishing method using the same | Kiyoshi Suzuki | 1997-09-16 |
| 5494862 | Method of making semiconductor wafers | Tadahiro Kato, Masami Nakano, Sunao Shima | 1996-02-27 |
| 5447890 | Method for production of wafer | Tadahiro Kato, Sunao Shima, Masami Nakano, Hideo Kudo | 1995-09-05 |