Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6235865 | Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition | Minoru Takei, Toshio Shiobara | 2001-05-22 |
| 6210811 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Miyuki Wakao, Toshio Shiobara | 2001-04-03 |
| 6084037 | Epoxy resin composition and semiconductor device | Minoru Takei, Masachika Yoshino, Toshio Shiobara | 2000-07-04 |
| 5643975 | Epoxy resin compositions and cured products | Toshio Shiobara | 1997-07-01 |
| 5362887 | Fluorine - modified acid anhydrides | Toshio Shiobara, Koji Futatsumori, Kazuhiro Arai, Shigeki Ino | 1994-11-08 |
| 5340851 | Thermosetting resin compositions | Toshio Shiobara, Minoru Takei | 1994-08-23 |
| 5321299 | Hybrid integrated circuit device | Katsumi Ohkawa, Hirofumi Kikuchi | 1994-06-14 |
| 5306748 | Fluorine-modified thermosetting resin and thermosetting resin composition | Toshio Shiobara, Manabu Narumi | 1994-04-26 |
| 5300588 | Thermosetting resin compositions | Toshio Shiobara, Kazutoshi Tomiyoshi, Manabu Marumi | 1994-04-05 |
| 5298548 | Epoxy resin composition and semiconductor devices encapsulated therewith | Toshio Shiobara, Takayuki Aoki, Kazutoshi Tomiyoshi, Takashi Tsuchiya | 1994-03-29 |
| 5290882 | Thermosetting resin compositions | Toshio Shiobara, Manabu Narumi | 1994-03-01 |
| 5285107 | Hybrid integrated circuit device | Akira Kazami, Osamu Nakamoto, Katsumi Ohkawa, Yasuhiro Koike, Koji Nagahama +3 more | 1994-02-08 |
| 5242044 | Apparatus for rotating and conveying an article to be painted on coating line | Shoichi Yamaguchi | 1993-09-07 |
| 5243058 | Allyl or propenyl group-containing naphthalene derivatives | Toshio Shiobara, Kazutoshi Tomiyoshi, Manabu Narumi | 1993-09-07 |
| 5220991 | Conveying apparatus for coating line | Shoichi Yamaguchi, Shigeru Ogino | 1993-06-22 |
| 5182351 | Thermosetting resin compositions | Toshio Shiobara | 1993-01-26 |
| 5179176 | Propenyl group-containing epoxy resin | Toshio Shiobara, Takayuki Aoki | 1993-01-12 |
| 5173544 | Epoxy resin compositions | Kazutoshi Tomiyoshi, Hatsuji Shiraishi, Toshio Shiobara | 1992-12-22 |
| 5171869 | Allyl or propenyl group-containing naphthalene derivatives | Toshio Shiobara, Kazutoshi Tomiyoshi, Manabu Narumi | 1992-12-15 |
| 5159433 | Hybrid integrated circuit device having a particular casing structure | Akira Kazami, Osamu Nakamoto, Katsumi Ohkawa, Yasuhiro Koike, Koji Nagahama +3 more | 1992-10-27 |
| 5053445 | Epoxy resin composition | Kunio Itoh, Toshio Shiobara, Koji Futatsumori, Kazutoshi Tomiyoshi | 1991-10-01 |
| 5041014 | Electronic device having a pair of electrically connected insulating film coated covers | Ikuo Ito | 1991-08-20 |
| 4985751 | Resin-encapsulated semiconductor devices | Toshio Shiobara, Takashi Tsuchiya | 1991-01-15 |
| 4877822 | Epoxy resin composition | Kunio Itoh, Toshio Shiobara, Koji Futatsumori, Kazutoshi Tomiyoshi | 1989-10-31 |
| 4701482 | Epoxy resin composition for encapsulation of semiconductor devices | Kunio Itoh, Toshio Shiobara, Koji Futatsumori, Kazutoshi Tomiyoshi | 1987-10-20 |