SW

Shinichi Wakabayashi

SE Seiko Epson: 24 patents #686 of 7,774Top 9%
SC Shinko Electric Industries Co.: 21 patents #38 of 723Top 6%
Sumitomo Electric Industries: 11 patents #2,408 of 21,551Top 15%
PA Panasonic: 7 patents #3,841 of 21,108Top 20%
Honda Motor Co.: 2 patents #8,527 of 21,052Top 45%
SC Sankyo Seiki Mfg. Co.: 1 patents #107 of 244Top 45%
NE Nec: 1 patents #7,889 of 14,502Top 55%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
KL Kabushiki Kaisha Honda Lock: 1 patents #64 of 171Top 40%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
AA Autoliv Development Ab: 1 patents #518 of 1,363Top 40%
Overall (All Time): #29,905 of 4,157,543Top 1%
69
Patents All Time

Issued Patents All Time

Showing 51–69 of 69 patents

Patent #TitleCo-InventorsDate
5663601 Core winding set for a motor Susumu Kobayashi, Mithugi Ookubo, Ethuji Yamashita 1997-09-02
5656855 Lead frame and method for manufacturing same Katsuya Fukase, Takahiro Iijima, Masao Nakazawa 1997-08-12
5643433 Lead frame and method for manufacturing same Katsuya Fukase, Takahiro Iijima, Masao Nakazawa 1997-07-01
5620806 Organic material for EL device and EL device Norikazu Nakamura 1997-04-15
5514619 Method of producing a laser device Hitomaro Tougou, Yukio Toyoda 1996-05-07
5495836 Throttle-valve control apparatus for spark-ignition two-cycle engines Shoji Masuda, Masahiko Abe, Yoshiyasu Uchida, Yoichi Ishibashi 1996-03-05
5397740 Method of making an optical semiconductor device Yukio Toyoda, Hitomaro Tougou 1995-03-14
5384204 Tape automated bonding in semiconductor technique Kazuhito Yumoto, Norio Wakabayashi, Masao Nakazawa, Norio Wada, Fumio Kuraishi +1 more 1995-01-24
5376225 Method of forming fine structure on compound semiconductor with inclined ion beam etching Hitomaro Tougou, Yukio Toyoda 1994-12-27
5372675 Method for producing fine structure for electronic device Hitomaro Tougou, Yukio Toyoda 1994-12-13
5316640 Fabricating method of micro lens Hitomaro Tougou, Yukio Toyoda, Yoshimasa Ohki 1994-05-31
5311056 Semiconductor device having a bi-level leadframe Akihiko Murata 1994-05-10
5258062 Electroless gold plating solutions Masao Nakazawa, Masaaki Yoshitani 1993-11-02
5160995 Semiconductor IC device with dummy wires Satoshi Wada, Masayo Fukuda 1992-11-03
5153384 Circuit board and process for manufacturing same Takahiro Iijima 1992-10-06
5080980 Ceramic package for semiconductor device Noboru Sakaguchi, Yoshiro Nishiyama, Kunihiko Imai, Yoshikazu Hirabayashi 1992-01-14
4717459 Electrolytic gold plating solution Masao Nakazawa, Yoshirou Nishiyama 1988-01-05
4604167 Silver plating solution and silver plating process and pretreatment solution therefor Masako Takoh 1986-08-05
4259436 Method of making a take-carrier for manufacturing IC elements Seiichi Tabuchi 1981-03-31