SL

Stephen Lehman

SD Sdcmaterials: 14 patents #4 of 14Top 30%
IN Intel: 14 patents #2,910 of 30,777Top 10%
TB The Boeing: 8 patents #1,377 of 15,756Top 9%
EX ExxonMobil: 2 patents #3,932 of 10,161Top 40%
UF University of Florida Foundation: 1 patents #311 of 807Top 40%
📍 Spartanburg, SC: #11 of 569 inventorsTop 2%
🗺 South Carolina: #173 of 15,501 inventorsTop 2%
Overall (All Time): #82,187 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 26–39 of 39 patents

Patent #TitleCo-InventorsDate
8018063 Solder joint reliability in microelectronic packaging Daewoong Suh, Mukul Renavikar 2011-09-13
8009442 Directing the flow of underfill materials using magnetic particles Rahul N. Manepalli, Leonel Arana, Wendy Chan 2011-08-30
7700476 Solder joint reliability in microelectronic packaging Daewoong Suh, Mukul Renavikar 2010-04-20
7579046 Smart curing with a catalyst-functionalized surface Vijay Wakharkar 2009-08-25
7534649 Thermoset polyimides for microelectronic applications James C. Matayabas, Jr., Saikumar Jayaraman 2009-05-19
7504465 Linear functional copolymers of ethylene with precise and minimum run length distributions and methods of making thereof Lisa Saunders Baugh, Kenneth B. Wagener, Donald N. Schulz, Enock Berluche 2009-03-17
7402642 Linear functional copolymers of ethylene with precise and minimum run length distributions and method of making thereof Lisa Saunders Baugh, Kenneth B. Wagener, Donald N. Schulz, Enock Berluche 2008-07-22
7351784 Chip-packaging composition of resin and cycloaliphatic amine hardener 2008-04-01
7314778 Wafer-level processing of chip-packaging compositions including bis-maleimides Saikumar Jayaraman 2008-01-01
7291548 Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same Daewoong Suh, Saikumar Jayaraman, Mitesh Patel, Tiffany Byrne, Edward L. Martin +4 more 2007-11-06
7253088 Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same Daewoong Suh, Saikumar Jayaraman, Mitesh Patel, Tiffany Byrne, Edward L. Martin +4 more 2007-08-07
7224050 Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging James C. Matayabas, Jr., Leonel Arana 2007-05-29
7217600 Cyclic olefin polymers and catalyst for semiconductor applications 2007-05-15
6660813 Solid state metathesis chemistry Kenneth B. Wagener, Garrett W. Oakley, Jason Smith 2003-12-09