YK

Yong Hoon Kim

Samsung: 79 patents #762 of 75,807Top 2%
SH Sk Hynix: 9 patents #856 of 4,849Top 20%
KAIST: 7 patents #1,829 of 11,619Top 20%
KM Kia Motors: 6 patents #896 of 7,429Top 15%
HM Hyundai Motor: 6 patents #1,869 of 11,886Top 20%
FC Furukawa Electric Co.: 5 patents #398 of 2,370Top 20%
Google: 3 patents #8,000 of 22,993Top 35%
ST Stranco: 3 patents #4 of 13Top 35%
KC Kings Information & Network Co.: 2 patents #1 of 10Top 10%
KT Kwangju Institute Of Science And Technology: 2 patents #9 of 91Top 10%
KI Korea Electronics Technology Institute: 1 patents #338 of 614Top 60%
SC Sk Teletech Co.: 1 patents #4 of 12Top 35%
LG: 1 patents #17,402 of 26,165Top 70%
📍 Busan, CA: #1 of 26 inventorsTop 4%
Overall (All Time): #8,892 of 4,157,543Top 1%
126
Patents All Time

Issued Patents All Time

Showing 76–100 of 126 patents

Patent #TitleCo-InventorsDate
8970042 Circuit board, comprising a core insulation film Bok-Sik Myung, Chul Woo Kim, Kyung-Tae Na, Young Bae Kim, Hee-Seok Lee 2015-03-03
8921993 Semiconductor package having EMI shielding function and heat dissipation function In Ho Choi, Seong-Ho Shin 2014-12-30
8884421 Multi-chip package and method of manufacturing the same Un-Byoung Kang, Jong-Joo Lee, Tae Hong Min 2014-11-11
8873245 Embedded chip-on-chip package and package-on-package comprising same Hee-Seok Lee 2014-10-28
8872319 Stacked package structure including insulating layer between two stacked packages Hee-Seok Lee, Seong-Ho Shin, Se-Ho You, Yun-Hee Lee 2014-10-28
8791559 Semiconductor package with package on package structure Hyo-Soon Kang, Jin Kyung Kim 2014-07-29
8736032 Semiconductor device, semiconductor package, and electronic device In Ho Choi, Keung Beum Kim 2014-05-27
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Heung-Kyu Kwon, Seong-Ho Shin, Yun-Seok Choi 2014-03-25
8664751 Semiconductor package Hee-Seok Lee, Jin Jeong 2014-03-04
8652635 Insulated wire and resin dispersion Hideo Fukuda, Tadashi Ishii 2014-02-18
8633579 Multi-chip package and method of manufacturing the same Un-Byoung Kang, Jong-Joo Lee, Tae Hong Min 2014-01-21
8610471 Delay locked loop Hyun Woo Lee 2013-12-17
8587096 Semiconductor device including shielding layer and fabrication method thereof Hee-Seok Lee, Jin Jeong, Ji Hyun Lee 2013-11-19
8513996 Semiconductor memory apparatus and method for correcting duty thereof Chun-Seok Jeong 2013-08-20
8502580 Semiconductor device and method for operating the same Hyun Woo Lee 2013-08-06
8471613 Internal clock signal generator and operating method thereof Hyun Woo Lee 2013-06-25
8445996 Semiconductor package Hee-Seok Lee, Yun-Seok Choi 2013-05-21
8351284 Delay locked loop Hyun Woo Lee 2013-01-08
8319538 Semiconductor device Hyun Woo Lee 2012-11-27
8314160 Thermoplastic resin foam Kohji Masuda, Masayasu Ito, Kojiro Inamori, Naoki Yoshida, Michiaki Kawakami +2 more 2012-11-20
8291210 Methods of booting application processors from external devices Yun Tae Lee, Sung-Up Choi 2012-10-16
8253228 Package on package structure Byeong-Yeon Cho, Hee-Seok Lee 2012-08-28
8214896 Method of securing USB keyboard Seong Ho Cheong 2012-07-03
8156346 Keyboard-input information-security apparatus and method 2012-04-10
7873822 System comprising electronic device and external device storing boot code for booting system Yun Tae Lee, Sung-Up Choi 2011-01-18