Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7462871 | Side-view light emitting diode having protective device | Kyung Taeg Han, Myoung Soo Choi, Jong Uk Park, Chang-Wook Kim | 2008-12-09 |
| 7458703 | Light emitting diode package having dual lens structure for lateral light emission | Kyung Taeg Han, Myoung Soo Choi, Seong Yeon Han, Hun Joo Hahm, Chang Ho Song | 2008-12-02 |
| D568261 | Light-emitting diode | Geun Chang Ryo, Yong Tae Kim, Young Jae Song | 2008-05-06 |
| 7338823 | Side-emitting LED package and manufacturing method of the same | Kyung Taeg Han, Hun Joo Hahm, Dae Yeon Kim, Ho Sik Ahn, Seong Yeon Han +1 more | 2008-03-04 |
| RE40112 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Sang Ho Lee, Vincent DiCaprio | 2008-02-26 |
| 7211900 | Thin semiconductor package including stacked dies | Won Sun Shin, Do Sung Chun, Il Kwon Shim, Vincent DiCaprio | 2007-05-01 |
| 7208772 | High power light emitting diode package | Chang-Wook Kim, Kyung Taeg Han | 2007-04-24 |
| 7190071 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio | 2007-03-13 |
| 7156538 | LED package for backlight unit | Kyung Taeg Han, Chan Wang Park | 2007-01-02 |
| 7157029 | Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method | Joon Ho Yoon, Doo Hoon Ahn | 2007-01-02 |
| 6995448 | Semiconductor package including passive elements and method of manufacture | Sang Ho Lee, Jun Yang, Jong Hae Hyun, Choon Heung Lee | 2006-02-07 |
| 6982485 | Stacking structure for semiconductor chips and a semiconductor package using it | Young-Ho Kim, Choon Heung Lee | 2006-01-03 |
| D512694 | Light-emitting diode | Chang-Wook Kim, Kyung Taeg Han | 2005-12-13 |
| D512029 | Light-emitting diode | Chang-Wook Kim, Kyung Taeg Han | 2005-11-29 |
| 6936922 | Semiconductor package structure reducing warpage and manufacturing method thereof | Sung Soon Park, Sang Jae Jang, Choon Heung Lee, Eun Sook Sohn, Sung Su Park | 2005-08-30 |
| 6798049 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Il Kwon Shim, Vincent DiCaprio | 2004-09-28 |
| 6717248 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio | 2004-04-06 |
| 6515356 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio | 2003-02-04 |
| 6469258 | Circuit board for semiconductor package | Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Won Kyun Lee +2 more | 2002-10-22 |
| 6303997 | Thin, stackable semiconductor packages | — | 2001-10-16 |
| 5986334 | Semiconductor package having light, thin, simple and compact structure | — | 1999-11-16 |