Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6723644 | Method of fabricating a semiconductor device using two chemical mechanical polishing processes to polish regions having different conductive pattern densities | Jung-yup Kim | 2004-04-20 |
| 6716732 | Method for fabricating a contact pad of semiconductor device | Young-rae Park, Jung-yup Kim, Bo-Un Yoon | 2004-04-06 |
| 6712078 | Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same | Im-Soo Park, Kun-Tack Lee, Yong-Pil Han | 2004-03-30 |
| 6699749 | Method for manufacturing a metal-insulator-metal capacitor | Seung-gun Lee, Il-Goo Kim, Ho-Sen Chang, Ju-Hyuk Chang | 2004-03-02 |
| 6649471 | Method of planarizing non-volatile memory device | Min-Soo Cho, Dong-Jun KIM, Eui-Youl Ryu, Dai-Goun Kim, Young-Hee Kim +3 more | 2003-11-18 |
| 6626968 | Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same | Young-rae Park, Jung-yup Kim, Bo-Un Yoon, Kwang-bok Kim, Jae-Phil Boo +3 more | 2003-09-30 |
| 6610596 | Method of forming metal interconnection using plating and semiconductor device manufactured by the method | Jong Won Lee, Bo-Un Yoon, Kun-Tack Lee | 2003-08-26 |
| 6585570 | Method and apparatus for supplying chemical-mechanical polishing slurries | Jung-yup Kim, Young-rae Park | 2003-07-01 |
| 6565736 | WET PROCESS FOR SEMICONDUCTOR DEVICE FABRICATION USING ANODE WATER CONTAINING OXIDATIVE SUBSTANCES AND CATHODE WATER CONTAINING REDUCTIVE SUBSTANCES, AND ANODE WATER AND CATHODE WATER USED IN THE WET PROCESS | Im-Soo Park, Kun-Tack Lee, Young Min Kwon, Woo-Gwan Shim, Hyung-Ho Ko | 2003-05-20 |
| 6548388 | Semiconductor device including gate electrode having damascene structure and method of fabricating the same | Hong-kyu Hwang, Young-rae Park, Jung-yup Kim, Jeong-sic Jeon, Bo-Un Yoon | 2003-04-15 |
| 6540935 | Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same | Jong Won Lee, Jae-Dong Lee, Bo Yoon | 2003-04-01 |
| 6518157 | Methods of planarizing insulating layers on regions having different etching rates | Gee-won Nam, Gi-jong Park, Hong-kyu Hwang, Jun-Shik Bae, Young-rae Park +2 more | 2003-02-11 |
| 6517412 | Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same | Jae-Dong Lee, Bo-Un Yoon, Kyoung-mo Yang | 2003-02-11 |
| 6514862 | Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same | Jae-Dong Lee, Jong Won Lee, Bo-Un Yoon | 2003-02-04 |
| 6506682 | Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof | Jong Won Lee | 2003-01-14 |
| 6498102 | Method for planarizing a semiconductor device using ceria-based slurry | Jung-yup Kim, Young-rae Park | 2002-12-24 |
| 6335287 | Method of forming trench isolation regions | Hong-kyu Hwang, Bo-Un Yoon, Kyu-hwan Chang | 2002-01-01 |
| 6254767 | Semiconductor device manufacturing apparatus having controller detecting function of filter | Sung-ki Shin | 2001-07-03 |