Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9430101 | Flat panel display with integrated touch screen panel | Kwan-Young Han | 2016-08-30 |
| 9305899 | Method of fabricating semiconductor package | Jae-Yong Park, Sang Jun Kim | 2016-04-05 |
| 9255959 | Test apparatus for semiconductor package | Chan-Sik Kwon, Seok-Won JEONG, Jae Ho Choi | 2016-02-09 |
| 9207273 | Apparatus for inspecting touch panel and method thereof | — | 2015-12-08 |
| 9184065 | Method of molding semiconductor package | Jae-Yong Park, Heui-Seog Kim, Ho-Geon Song | 2015-11-10 |
| 8956921 | Method of molding semiconductor package | Jae-Yong Park, Heui-Seog Kim, Ho-Geon Song | 2015-02-17 |
| 8956923 | Methods of fabricating semiconductor devices and underfill equipment for the same | Young-Ja Kim, Dae-Young Jeong, Dae-Sang Chan | 2015-02-17 |
| 8482133 | Semiconductor package | Jae-Yong Park | 2013-07-09 |
| 8420450 | Method of molding semiconductor package | Jae-Yong Park, Heui-Seog Kim, Ho-Geon Song | 2013-04-16 |
| 8039972 | Printed circuit board and method thereof and a solder ball land and method thereof | Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Ho-Geon Song | 2011-10-18 |
| 7863161 | Method of cutting a wafer | Dae-Sang Chan, Wha-Su Sin, Jae-Yong Park | 2011-01-04 |
| 7745932 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same | Dae-Sang Chan, Jae-Yong Park, Heui-Seog Kim, Wha-Su Sin | 2010-06-29 |
| 7713788 | Method of manufacturing semiconductor package using redistribution substrate | Dae-Sang Chan, Heui-Seog Kim, Wha-Su Sin, Jae-Yong Park | 2010-05-11 |
| 7696615 | Semiconductor device having pillar-shaped terminal | Dae-Sang Chan, Wha-Su Sin | 2010-04-13 |
| 7591714 | Wafer grinding and tape attaching apparatus and method | Dae-Sang Chan, Sang Jun Kim | 2009-09-22 |
| 7576438 | Printed circuit board and method thereof and a solder ball land and method thereof | Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Ho-Geon Song | 2009-08-18 |
| 7420382 | Apparatus and method for testing semiconductor chip | Seok-Young Yoon, Hyeck-Jin Jeong | 2008-09-02 |
| 6065381 | Apparatus for cutting tie bars of semiconductor packages | Jong Won Kim, Young Jin Choi, Po-seong Park | 2000-05-23 |