Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431259 | Conductive particle, conductive materials and connection structure | Yeong Jin Lim, Kyung Heum Kim, Chang-Wan Bae, Hyeon Yun Jeong, Hyun-Sang Cho +1 more | 2025-09-30 |
| 9484323 | Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same | — | 2016-11-01 |
| 9255959 | Test apparatus for semiconductor package | Chan-Sik Kwon, Jae Ho Choi, Jun-Young Ko | 2016-02-09 |
| 8440881 | Plants having enhanced yield-related traits and a method for making the same | Youn-Il Park, Yang Do Choi, In Gyu Hwang, Jonghee Oh | 2013-05-14 |