Issued Patents All Time
Showing 76–91 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7598117 | Method for manufacturing semiconductor module using interconnection structure | Koji Soejima, Masaya Kawano | 2009-10-06 |
| 7592692 | Semiconductor device with a dummy electrode | — | 2009-09-22 |
| 7556983 | Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same | — | 2009-07-07 |
| 7554205 | Flip-chip type semiconductor device | Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada | 2009-06-30 |
| 7538022 | Method of manufacturing electronic circuit device | Koji Soejima, Masaya Kawano | 2009-05-26 |
| 7495345 | Semiconductor device-composing substrate and semiconductor device | Koji Soejima, Masaya Kawano | 2009-02-24 |
| 7370786 | Bonding method and bonding apparatus | Jun Nogawa, Masato Maeda, Teruji Inomata | 2008-05-13 |
| 7262486 | SOI substrate and method for manufacturing the same | Masaya Kawano, Tsutomu Tashiro | 2007-08-28 |
| 7238548 | Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device | Rieka Ouchi, Takashi Miyazaki, Toshiyuki Yamada | 2007-07-03 |
| 7034386 | Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same | — | 2006-04-25 |
| 6932262 | Bonding method and bonding apparatus | Jun Nogawa, Masato Maeda, Teruji Inomata | 2005-08-23 |
| 6930396 | Semiconductor device and method for manufacturing the same | Toshiaki Shironouchi, Takashi Tetsuka | 2005-08-16 |
| 6822336 | Semiconductor device | — | 2004-11-23 |
| 6814274 | Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method | Teruji Inomata | 2004-11-09 |
| 6753238 | Semiconductor device and manufacturing method thereof | — | 2004-06-22 |
| 6740811 | Electric terminal for an electronic device | — | 2004-05-25 |