Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7554191 | Semiconductor device having a heatsink plate with bored portions | Yoshiaki Sanada | 2009-06-30 |
| 7370786 | Bonding method and bonding apparatus | Yoichiro Kurita, Jun Nogawa, Masato Maeda | 2008-05-13 |
| 6932262 | Bonding method and bonding apparatus | Yoichiro Kurita, Jun Nogawa, Masato Maeda | 2005-08-23 |
| 6814274 | Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method | Yoichiro Kurita | 2004-11-09 |