Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820400 | Package and method for fabricating package | Yasuhiro Ishii, Hideki Tanaka | 2017-11-14 |
| 7763985 | Flip-chip type semiconductor device | Yoichiro Kurita, Takashi Miyazaki, Toshiyuki Yamada | 2010-07-27 |
| 7554205 | Flip-chip type semiconductor device | Yoichiro Kurita, Takashi Miyazaki, Toshiyuki Yamada | 2009-06-30 |
| 7238548 | Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device | Yoichiro Kurita, Takashi Miyazaki, Toshiyuki Yamada | 2007-07-03 |