Issued Patents All Time
Showing 26–50 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847325 | Electronic device | Masaya Kawano, Koji Soejima | 2017-12-19 |
| 9728519 | Bonding method of semiconductor chip and bonding apparatus of semiconductor chip | — | 2017-08-08 |
| 9721935 | Semiconductor device and manufacturing method thereof | Kazushige Kawasaki | 2017-08-01 |
| 9595507 | Semiconductor device and method of manufacturing the same | — | 2017-03-14 |
| 9406602 | Electronic device | Masaya Kawano, Koji Soejima | 2016-08-02 |
| 9396998 | Semiconductor device having fan-in and fan-out redistribution layers | Hirokazu Ezawa, Kazushige Kawasaki, Satoshi Tsukiyama | 2016-07-19 |
| 9324699 | Semiconductor device | — | 2016-04-26 |
| 8975750 | Electronic device | Masaya Kawano, Koji Soejima | 2015-03-10 |
| 8916976 | Semiconductor device and method of manufacturing the same | Masamoto Tago | 2014-12-23 |
| 8890305 | Semiconductor device | — | 2014-11-18 |
| 8823174 | Electronic device | Masaya Kawano, Koji Soejima | 2014-09-02 |
| 8685796 | Electronic device and method of manufacturing the same | Koji Soejima, Masaya Kawano | 2014-04-01 |
| 8633591 | Electronic device | Masaya Kawano, Koji Soejima | 2014-01-21 |
| 8552570 | Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device | Katsumi Kikuchi, Shintaro Yamamichi, Masaya Kawano, Kouji Soejima | 2013-10-08 |
| 8541874 | Semiconductor device | — | 2013-09-24 |
| 8456020 | Semiconductor package and method of manufacturing the same | Masaya Kawano | 2013-06-04 |
| 8395269 | Method of stacking semiconductor chips including forming an interconnect member and a through electrode | Masaya Kawano, Koji Soejima, Nobuaki Takahashi, Masahiro Komuro, Satoshi Matsui | 2013-03-12 |
| 8354340 | Electronic device and method of manufacturing the same | Masaya Kawano, Koji Soejima | 2013-01-15 |
| 8349649 | Semiconductor device and manufacturing method thereof | — | 2013-01-08 |
| 8304870 | Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device | — | 2012-11-06 |
| 8278143 | Manufacturing method for electronic devices | — | 2012-10-02 |
| 8207605 | Semiconductor device having a sealing resin and method of manufacturing the same | — | 2012-06-26 |
| 8193033 | Semiconductor device having a sealing resin and method of manufacturing the same | — | 2012-06-05 |
| 8114766 | Method for manufacturing semiconductor device | Koji Soejima, Masaya Kawano | 2012-02-14 |
| 8058165 | Semiconductor device and method of manufacturing the same | Masaya Kawano, Koji Soejima | 2011-11-15 |