Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9082839 | Method and apparatus for plasma dicing a semi-conductor wafer | Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard +3 more | 2015-07-14 |
| 9070760 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Gordon M. Grivna | 2015-06-30 |
| 8980764 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Gordon M. Grivna | 2015-03-17 |
| 8946058 | Method and apparatus for plasma dicing a semi-conductor wafer | Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard +1 more | 2015-02-03 |
| 8802545 | Method and apparatus for plasma dicing a semi-conductor wafer | Chris Johnson, David Johnson, David Pays-Volard, Linnell Martinez, Gordon M. Grivna | 2014-08-12 |
| 8796154 | Method and apparatus for plasma dicing a semi-conductor wafer | Chris Johnson, David Johnson, David Pays-Volard, Linnell Martinez, Gordon M. Grivna | 2014-08-05 |
| 8785332 | Method and apparatus for plasma dicing a semi-conductor wafer | Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin +1 more | 2014-07-22 |
| 8778806 | Method and apparatus for plasma dicing a semi-conductor wafer | Chris Johnson, David Johnson, David Pays-Volard, Linnell Martinez, Gordon M. Grivna | 2014-07-15 |
| 8691702 | Method and apparatus for plasma dicing a semi-conductor wafer | Dwarakanath Geerpuram, David Pays-Volard, Linnell Martinez, Chris Johnson, David Johnson | 2014-04-08 |
| 8187483 | Method to minimize CD etch bias | Jason Plumhoff, Sunil Srinivasan, David Johnson | 2012-05-29 |
| 7959819 | Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes | Shouliang Lai, David Johnson | 2011-06-14 |
| 7867403 | Temperature control method for photolithographic substrate | Jason Plumhoff, Larry Ryan, John Nolan, David Johnson | 2011-01-11 |
| 7713432 | Method and apparatus to improve plasma etch uniformity | David Johnson | 2010-05-11 |
| 7381650 | Method and apparatus for process control in time division multiplexed (TDM) etch processes | David Johnson, Mike Teixeira, Shouliang Lai | 2008-06-03 |
| 7115520 | Method and apparatus for process control in time division multiplexed (TDM) etch process | David Johnson, Shouliang Lai | 2006-10-03 |
| 7101805 | Envelope follower end point detection in time division multiplexed processes | David Johnson | 2006-09-05 |
| 7008877 | Etching of chromium layers on photomasks utilizing high density plasma and low frequency RF bias | Christopher Constantine, Jason Plumhoff, David Johnson | 2006-03-07 |
| 6982175 | End point detection in time division multiplexed etch processes | David Johnson | 2006-01-03 |
| 6924235 | Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method | David Johnson, Shouliang Lai | 2005-08-02 |
| 6905626 | Notch-free etching of high aspect SOI structures using alternating deposition and etching and pulsed plasma | David Johnson, Shouliang Lai | 2005-06-14 |
| 6846747 | Method for etching vias | David Johnson | 2005-01-25 |
| 6544696 | Embedded attenuated phase shift mask and method of making embedded attenuated phase shift mask | Christopher Constantine | 2003-04-08 |