Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate support providing gap height and planarization adjustment in plasma processing chamber

Substrate support providing gap height and planarization adjustment in plasma processing chamber

US Patent RE47275 · Granted Mar 5, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Tunability of edge plasma density for tilt control2025
Radiofrequency signal filter arrangement for plasma processing system2025
Methods and systems for managing byproduct material accumulation during plasma-b2025
Low frequency RF generator and associated electrostatic chuck2025
Systems and methods for controlling a plasma sheath characteristic2025
Systems and methods for optimizing power delivery to an electrode of a plasma ch2025
Electrostatic edge ring mounting system for substrate processing2025
Distortion of pulses for wafer biasing2025
Systems and methods for use of low frequency harmonics in bias radiofrequency su2025
Systems and methods for using binning to increase power during a low frequency c2025
Process control for ion energy delivery using multiple generators and phase cont2025
Electrostatic chucks with coolant gas zones and corresponding groove and monopol2025