Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating

Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating

US Patent 9631919 · Granted Apr 25, 2017

Estimated economic value: $22,808,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

In-situ reflectometry for real-time process control2025
Plasma source with floating electrodes2025
Multi-zone heater control for wafer processing equipment2025
Vertically adjustable plasma source2025
System and method to map thickness variations of substrates in manufacturing sys2025
Autonomous substrate processing system2025
Microwave plasma source for spatial plasma enhanced atomic layer deposition (PE-2025
In-line monitoring of OLED layer thickness and dopant concentration2025
Spatial pattern loading measurement with imaging metrology2025
Magnetically coupled RF filter for substrate processing chambers2025
Surface roughness and emissivity determination2024
Bipolar esc with balanced RF impedance2024