Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method to map thickness variations of substrates in manufacturing systems

System and method to map thickness variations of substrates in manufacturing systems

US Patent 12276490 · Granted Apr 15, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

In-situ reflectometry for real-time process control2025
Time delay integration acquisition for spatial genomics imaging2025
Subsurface alignment metrology system for packaging applications2025
Image based metrology of surface deformations2025
Autonomous substrate processing system2025
Metrology system for packaging applications2025
In-line monitoring of OLED layer thickness and dopant concentration2025
Spatial pattern loading measurement with imaging metrology2025
Spatial pattern loading measurement with imaging metrology2025
Surface roughness and emissivity determination2024
Surface roughness and emissivity determination2024
Optical metrology models for in-line film thickness measurements2024