Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer back-side polishing system and method for integrated circuit device manufacturing processes

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

US Patent 9559021 · Granted Jan 31, 2017

Estimated economic value: $2,335,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for selectively forming hard mask2025
Chemical mechanical polishing slurry composition and method of polishing metal l2025
Chemical mechanical polishing slurry composition and method of polishing metal l2025
Semiconductor structure with staggered selective growth2025
Contact plugs for semiconductor device and method of forming same2025
Contact plugs for semiconductor device and method of forming same2025
Wafer taping apparatus and method2025
Partial barrier free vias for cobalt-based interconnects and methods of fabricat2025
Partial barrier free vias for cobalt-based interconnects and methods of fabricat2025
Spacer structure for semiconductor device2025
Vertical device having a protrusion source2025
Integrated circuit with a Fin and gate structure and method making the same2025