Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate for alternative semiconductor die configurations

Substrate for alternative semiconductor die configurations

US Patent 9437492 · Granted Sep 6, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device package substrate structure and method therefor2025
Packaged semiconductor device assembly2024
Device package substrate structure and method therefor2023
Circuit modules with front-side interposer terminals and through-module thermal 2023
Package with conductive underfill ground plane2022
Hybrid package2021
Semiconductor device with bond wire reinforcement structure2021
Method of fabricating embedded traces2021
Micro-selective sintering laser systems and methods thereof2020
Substrate dielectric crack prevention using interleaved metal plane2020
Substrate interconnections for packaged semiconductor device2018
Substrate interconnections for packaged semiconductor device2018