Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device package substrate structure and method therefor

Device package substrate structure and method therefor

US Patent 12341089 · Granted Jun 24, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Packaged semiconductor device assembly2024
Device package substrate structure and method therefor2023
Device package substrate structure and method therefor2023
Device package substrate structure and method therefor2023
Package with conductive underfill ground plane2022
3D chip testing through micro-C4 interface2021
Hybrid package2021
Method of fabricating embedded traces2021
Method of fabricating embedded traces2021
Electronic module power supply2020
Micro-selective sintering laser systems and methods thereof2020
Substrate dielectric crack prevention using interleaved metal plane2020