Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit modules with front-side interposer terminals and through-module thermal dissipation structures

Circuit modules with front-side interposer terminals and through-module thermal dissipation structures

US Patent 11581241 · Granted Feb 14, 2023

Estimated economic value: $31,132,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low-stress thermal interface2025
Circuit modules with encapsulant-embedded leadframe terminals, and methods of fa2025
Circuit modules with encapsulant-embedded leadframe terminals, and methods of fa2025
Circuit modules with encapsulant-embedded leadframe terminals, and methods of fa2025
3D point-cloud labeling2025
Conduit inserts for encapsulant compound formulation kneading and encapsulation 2025
Automated estimation of needed resources related to labeling a labeling service 2025
CMAS-resistant barrier coatings2025
CMAS-resistant abradable coatings2025
Automated identification of labels for videos with a labeling service within a s2025
CMAS-resistant environmental barrier coating system2025
Surface-mount amplifier devices2024