Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interface treatment of semiconductor surfaces with high density low energy plasma

Interface treatment of semiconductor surfaces with high density low energy plasma

US Patent 9378941 · Granted Jun 28, 2016

Estimated economic value: $9,817,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor processing device2025
Systems and methods for controlling a voltage waveform at a substrate during pla2025
Apparatus and method for controlling edge ring variation2025
Substrate susceptor using edge purging2025
Vapor deposition of films comprising molybdenum2025
Electrostatic chuck for high bias radio frequency (RF) power application in a pl2025
Plasma processing assembly using pulsed-voltage and radio-frequency power2025
Reducing aspect ratio dependent etch with direct current bias pulsing2025
Methods for depositing a molybdenum nitride film on a surface of a substrate by 2025
Apparatus and methods for performing an in-situ etch of reaction chambers with f2025
Smart dynamic load simulator for RF power delivery control system2024
Feedback loop for controlling a pulsed voltage waveform2024