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Home › Low temperature adhesive resins for wafer bonding

Low temperature adhesive resins for wafer bonding

US Patent 9324601 · Granted Apr 26, 2016

Estimated economic value: $2,956,000 ⓘ

Assignee

IBM

Inventors

Robert David Allen (115 patents)
Paul S. Andry (128 patents)
Jeffrey D. Gelorme (112 patents)
Li-Wen Hung (65 patents)
John U. Knickerbocker (308 patents)
Cornelia K. Tsang (79 patents)

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