Soft and conditionable chemical mechanical polishing pad stack

Assignee

• Rohm And Haas Electronic Materials Cmp Holdings
• Dow Global Technologies

Inventors

• James Murnane (13 patents)
• Bainian Qian (41 patents)
• John G. Nowland (9 patents)
• Michelle Jensen (9 patents)
• Jeffrey James Hendron (22 patents)
• Marty W. DeGroot (35 patents)
• David B. James (70 patents)
• Fengji Yeh (13 patents)

View full patent text on Google Patents →