Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Closed-loop control for improved polishing pad profiles

Closed-loop control for improved polishing pad profiles

US Patent 9138860 · Granted Sep 22, 2015

Estimated economic value: $10,938,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Control substrate polishing using constrained cost function2025
Semiconductor fabrication using process control parameter matrix2025
Control of processing parameters during substrate polishing using cost function2025
Determining substrate precession with acoustic signals2025
Eddy current monitoring to detect vibration in polishing2025
Insulated fluid lines in chemical mechanical polishing2025
Methods of modeling and controlling pad wear2025
Polishing apparatus using machine learning and compensation for pad thickness2025
Autonomous lane change method and apparatus, and storage medium2025
Generating synthetic training data including document images with key-value pair2025
Multi-stage machine learning model training for key-value extraction2025
Ultrathin atomic layer deposition film accuracy thickness control2025