Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

US Patent 9136142 · Granted Sep 15, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device packaging warpage control2024
Tie bar removal for semiconductor device packaging2024
Semiconductor device packaging warpage control2023
Semiconductor device packaging warpage control2023
Semiconductor device having integrated antenna and method therefor2023
Semiconductor device packaging warpage control2022
Tie bar removal for semiconductor device packaging2022
Semiconductor packages and methods for forming semiconductor package2019
Semiconductor packages and methods of packaging semiconductor devices2019
Multi-via redistribution layer for integrated circuits having solder balls2019
Semiconductor packages and methods of packaging semiconductor devices2018
Semiconductor packages and methods of packaging semiconductor devices2018