Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of metal sputtering for integrated circuit metal routing

Method of metal sputtering for integrated circuit metal routing

US Patent 8723322 · Granted May 13, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Foam blend incorporating phase change material and method for making foamed shoe2025
Cylindrical bonding structure and method of manufacture2014
Circuitry component and method for forming the same2014
Chip package and method for fabricating the same2014
Carbon nanotube circuit component structure2014
Wafer level processing method and structure to manufacture two kinds of intercon2014
Integrated circuit wafer dicing method2013
Integrated circuit chips with fine-line metal and over-passivation metal2013
Post passivation structure for a semiconductor device and packaging process for 2013
Very thick metal interconnection scheme in IC chips2013
Die structure and die connecting method2013
Method for fabricating circuit component2013