Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Post passivation structure for a semiconductor device and packaging process for same

Post passivation structure for a semiconductor device and packaging process for same

US Patent 8558383 · Granted Oct 15, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Foam blend incorporating phase change material and method for making foamed shoe2025
Logic drive based on standard commodity FPGA IC chips using non-volatile memory 2025
Logic drive based on chip scale package comprising standardized commodity progra2025
Vertical interconnect elevator based on through silicon vias2025
Logic drive based on multichip package using interconnection bridge2025
Logic drive based on chip scale package comprising standardized commodity progra2025
Methods of utilizing etch-stop material during fabrication of capacitors, integr2025
Logic drive based on multichip package comprising standard commodity FPGA IC chi2025
Multi-output look-up table (LUT) for use in coarse-grained field-programmable-ga2025
Logic drive based on standardized commodity programmable logic semiconductor IC 2025
3D chip package based on vertical-through-via connector2024
Logic drive based on standard commodity FPGA IC Chips using non-volatile memory 2024