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Home › Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications

Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications

US Patent 8211325 · Granted Jul 3, 2012

Estimated economic value: $11,712,000 ⓘ

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