Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and process for in situ byproduct removal and platen cooling during CMP

System and process for in situ byproduct removal and platen cooling during CMP

US Patent 10350728 · Granted Jul 16, 2019

Estimated economic value: $26,330,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pressure signals during motor torque monitoring to provide spatial resolution2025
Circuits and methods for measuring the output current of a switched capacitor re2025
Circuits and methods for hybrid 3:1 voltage regulators2025
Training a machine learning system to detect an excursion of a CMP component usi2024
Polishing platens and polishing platen manufacturing methods2024
Detecting an excursion of a CMP component using time-based sequence of images2024
Circuits for a hybrid switched capacitor converter2024
Multi-mode display for documents in a web browser client application2024
Slurry distribution device for chemical mechanical polishing2024
Preston matrix generator2024
Motor torque endpoint during polishing with spatial resolution2024
Chemical mechanical polishing slurry buildup monitoring2024