Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for plating semiconductor wafers

Method and apparatus for plating semiconductor wafers

US Patent 8048283 · Granted Nov 1, 2011

Estimated economic value: $17,114,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Roller for location-specific wafer polishing2025
Polishing articles and integrated system and methods for manufacturing chemical 2024
Integrated abrasive polishing pads and manufacturing methods2024
Zincating and doping of metal liner for liner passivation and adhesion improveme2024
CMP pad construction with composite material properties using additive manufactu2024
Polishing system with annular platen or polishing pad2023
Polishing system with support post and annular platen or polishing pad2022
Integrated abrasive polishing pads and manufacturing methods2022
Precursor formulations for polishing pads produced by an additive manufacturing 2022
Metal liner passivation and adhesion enhancement by zinc doping2022
Electrochemical doping of thin metal layers employing underpotential deposition 2022
Polishing pads produced by an additive manufacturing process2020