Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level surface passivation of stackable integrated circuit chips

Wafer level surface passivation of stackable integrated circuit chips

US Patent 7923349 · Granted Apr 12, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package-on-package assembly with wire bond vias2025
Methods and related aspects for pathology prognosis2024
Techniques, devices, and instruction set architecture for balanced and secure la2024
Methods and related aspects for pathology prognosis2024
Method of recommending cosmetics based on melanin index and hemoglobin index and2023
Package-on-package assembly with wire bond vias2023
Water heater and boiler processes2023
Chip front surface touchless pick and place tool or flip chip bonder2022
Package-on-package assembly with wire bond vias2021
Pressing of wire bond wire tips to provide bent-over tips2020
Pressing of wire bond wire tips to provide bent-over tips2020
Light emitting device2020