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Home › Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop

Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop

US Patent 7910476 · Granted Mar 22, 2011

Estimated economic value: $5,133,000 ⓘ

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