Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etch stop layer for a metallization layer with enhanced adhesion, etch selectivity and hermeticity

Etch stop layer for a metallization layer with enhanced adhesion, etch selectivity and hermeticity

US Patent 7867917 · Granted Jan 11, 2011

Estimated economic value: $5,518,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Recommendation non-transitory computer-readable medium, method, and system for m2024
Method for controlling a hydrodynamic machine and hydrodynamic machine2023
Edge configuration of software systems for manufacturing2020
Emerging issue detection and analysis2020
Semiconductor device comprising a die seal including long via lines2020
Semiconductor device comprising a die seal including long via lines2018
Metal line layout based on line shifting2018
Self service propagation of custom extension fields into web services2016
Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for 2016
Semiconductor device including a stress buffer material formed above a low-k met2016
Stable anchors in user interface to support life cycle extensions2016
Semiconductor device with improved metal pillar configuration2015