Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for semiconductor wafer electroplanarization

Apparatus and method for semiconductor wafer electroplanarization

US Patent 7648616 · Granted Jan 19, 2010

Estimated economic value: $8,291,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vapor cleaning of substrate surfaces2025
Zincating and doping of metal liner for liner passivation and adhesion improveme2024
Metal liner passivation and adhesion enhancement by zinc doping2022
Electrochemical doping of thin metal layers employing underpotential deposition 2022
Method and apparatus for processing wafer-shaped articles2020
Metal liner passivation and adhesion enhancement by zinc doping2020
Selective electroless electrochemical atomic layer deposition in an aqueous solu2020
Layer-by-layer deposition using hydrogen2019
Electrochemical doping of thin metal layers employing underpotential deposition 2019
Self-forming barrier process2019
Method and apparatus for processing wafer-shaped articles2019
Interlevel conductor pre-fill utilizing selective barrier deposition2019