Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dynamic metrology sampling with wafer uniformity control

Dynamic metrology sampling with wafer uniformity control

US Patent 7567700 · Granted Jul 28, 2009

Estimated economic value: $11,761,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for plasma processing2025
Process control enabled VDC sensor for plasma process2025
Radio frequency (RF) system with embedded RF signal pickups2025
RF voltage and current (V-I) sensors and measurement methods2024
Apparatus for plasma processing2024
Parallel resonance antenna for radial plasma control2024
Methods for real-time pulse measurement and pulse timing adjustment to control p2024
RF voltage and current (V-I) sensors and measurement methods2023
Electric pressure systems for control of plasma properties and uniformity2023
Power generation systems and methods for plasma stability and control2023
RF voltage and current (V-I) sensors and measurement methods2023
RF measurement system and method2022