Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Building metal pillars in a chip for structure support

Building metal pillars in a chip for structure support

US Patent 7456098 · Granted Nov 25, 2008

Estimated economic value: $6,627,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for making printed wiring board, printed wiring board, and adhesive film 2024
Evaluation of wafer carcass alpha particle emission2024
Method to form air gap structure with dual dielectric layer2023
Manufacturing method for an artificially oriented piezoelectric film for integra2023
Semiconductor device with reduced via resistance2022
Forming ultra-thin chips for flexible electronics applications2022
Enhancement of iso-via reliability2022
Semiconductor device with reduced via resistance2022
Multi-chip package structure having high density chip interconnect bridge with e2021
Dual dielectric layer for closing seam in air gap structure2021
Modulating metal interconnect surface topography2021
Flexible electronics for wearable healthcare sensors2021