Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement

Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement

US Patent 7294574 · Granted Nov 13, 2007

Estimated economic value: $11,470,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Oil-water separation device2025
Magnetic thin film laminated structure and micro-inductive device thereof2025
System for target arcing mapping and plasma diagnosis2025
Method and system for dynamic stability control of power systems with renewable 2025
Method of forming contact metal2025
Methods for shaping magnetic fields during semiconductor processing2025
Methods and apparatus for controlling ion fraction in physical vapor deposition 2024
Submodule hybrid MMC with low full-bridge ratio and DC fault processing method t2024
Collimator for a physical vapor deposition chamber2024
Resistive sub-module hybrid MMC and direct current fault processing strategy the2024
Distributed voltage clamping method for 100% renewable-energy sending-end grid2024
Offshore wind farm low-frequency alternating-current uncontrolled rectification 2024