Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadless plastic chip carrier

Leadless plastic chip carrier

US Patent 7270867 · Granted Sep 18, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit packages and fabrication methods using bond-on-pad (BoP) substrate techn2025
Method for manufacturing wafer-level semiconductor packages2018
Cavity package with pre-molded substrate2018
Cavity package with die attach pad2018
Circuit board with corner hollows2018
Etch isolation LPCC/QFN strip2017
Etch isolation LPCC/QFN strip2017
Circuit board with via trace connection and method of making the same2017
Cavity package with pre-molded substrate2017
Semiconductor chip package with undermount passive devices2017
Cavity package with die attach pad2017
Cavity package with pre-molded cavity leadframe2017