Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cavity package with pre-molded substrate

Cavity package with pre-molded substrate

US Patent 9659855 · Granted May 23, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing wafer-level semiconductor packages2018
Cavity package with pre-molded substrate2018
Cavity package with die attach pad2018
Cavity package with die attach pad2017
Cavity package with pre-molded cavity leadframe2017
Method of fabricating an integrated circuit (IC) package having a plurality of s2016
Device for holding multiple semiconductor devices during thermocompression bondi2016
Cavity package with pre-molded cavity leadframe2016
Integrated circuit package having a plurality of spaced apart pad portions2012
Leadless plastic chip carrier with contact standoff2009
Electronic components such as thin array plastic packages and process for fabric2009
Multiple leadframe laminated IC package2008