Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic components such as thin array plastic packages and process for fabricating same

Electronic components such as thin array plastic packages and process for fabricating same

US Patent 7482690 · Granted Jan 27, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit packages and fabrication methods using bond-on-pad (BoP) substrate techn2025
Method for manufacturing wafer-level semiconductor packages2018
Cavity package with pre-molded substrate2018
Cavity package with die attach pad2018
Etch isolation LPCC/QFN strip2017
Cavity package with pre-molded substrate2017
Cavity package with die attach pad2017
Cavity package with pre-molded cavity leadframe2017
Method of fabricating an integrated circuit (IC) package having a plurality of s2016
Method of fabricating an integrated circuit (IC) package having a plurality of s2016
Device for holding multiple semiconductor devices during thermocompression bondi2016
Ball grid array package with improved thermal characteristics2016