Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etch isolation LPCC/QFN strip

Etch isolation LPCC/QFN strip

US Patent 9806006 · Granted Oct 31, 2017

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit packages and fabrication methods using bond-on-pad (BoP) substrate techn2025
Method of fabricating an integrated circuit (IC) package having a plurality of s2016
Method of fabricating an integrated circuit (IC) package having a plurality of s2016
Ball grid array package with improved thermal characteristics2016
Flip chip pad geometry for an IC package substrate2016
Method of manufacturing leadless integrated circuit packages having electrically2016
Ball grid array package with improved thermal characteristics2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013
Method of manufacturing leadless integrated circuit packages having electrically2013
Substrate for integrated circuit package with selective exposure of bonding comp2012
Integrated circuit package having a plurality of spaced apart pad portions2012