Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof

Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof

US Patent 8338924 · Granted Dec 25, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microfluidic apparatus, and drive circuit and drive method thereof2024
Etch isolation LPCC/QFN strip2017
Method of manufacturing leadless integrated circuit packages having electrically2016
Leadless integrated circuit package having standoff contacts and die attach pad2016
Leadless array plastic package with various IC packaging configurations2014
Leadless integrated circuit package having standoff contacts and die attach pad2014
Use of CL2 and/or HCL during silicon epitaxial film formation2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013
Pre-bonded substrate for integrated circuit package and method of making the sam2013